2012 International Symposium on Software Testing and Analysis (ISSTA 2012)
July 15th-20th, 2012, Minneapolis, MN
ISSTA is the leading research symposium in software testing and analysis, bringing together academics, industrial researchers, and practitioners to exchange new ideas, problems, and experience on how to analyze and test software systems. ISSTA 2012 will be held in Minneapolis, Minnesota, in the McNamara Alumni Center on the University of Minnesota campus.
ISSTA week consists of two and a half days of co-located workshops and two and a half days of technical papers. Workshops will explore a range of emerging topics in software testing and analysis. Full or half-day workshops in the days preceding the main technical program of ISSTA provide focused research communities with an opportunity for technical interchange within the overall context of ISSTA. Each day of the ISSTA symposium will begin with an invited keynote address given by a highly-regarded expert, bringing fresh perspectives on the challenges of testing and analysis of software systems.
Technical Program
Authors are invited to submit technical papers describing original research in testing or analysis of computer software. Papers describing theoretical or empirical research, new techniques, or in-depth case studies of testing and analysis methods and tools are welcome. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this symposium. Authors of accepted papers will be required to sign an ACM copyright release.
Workshops
Organizers are invited to submit proposals for full-day and half-day workshops on topics related to software testing and analysis. Proposals should include a description of the workshop’s scope and intended number of participants, and on how participants will be selected. Proposals should also provide some information on how the workshop will be structured, and on the background of the organizers. Proposals may be up to 2 pages in ACM conference format.
Technical Paper Submission Guidelines
Technical papers must be prepared in ACM conference format and must not exceed 11 pages, including figures, references and appendices. All submissions must be in English. Submit your paper via the paper submission website. Submissions that do not adhere to these guidelines, including any that are longer than 11 pages, or that violate formatting to fit in the page limit, will be declined without review.
Important Dates
Workshop Proposal Submission Deadline: Friday, November 18, 2011
Workshop Notification: Friday, December 16, 2011
Technical Paper Submission Deadline: Friday, February 10, 2012
Technical Paper Author Notification: Friday, April 20, 2012
Author response period: March 19th - 22nd
Submission of Camera-Ready Copies: Friday, May 18, 2012
Conference: Monday-Friday, July 15-20, 2012
Conference Organization
General Chair
Mats Heimdahl,
University of Minnesota
Program Chair
Zhendong Su,
University of California, Davis
Local Arrangements Chair
Michael Whalen,
University of Minnesota
Web Chair
Jason Biatek,
University of Minnesota
Program Committee
George Avrunin, University of Massachusetts, USA
Antonia Bertolino, ISTI-CNR, Italy
Victor Braberman, Universidad De Buenos Aires, Argentina
Myra Cohen, University of Nebraska, USA
Mark Harman, University College London, UK
William G.J. Halfond, University of Southern California, USA
Mary Jean Harrold, Georgia Institute of Technology, USA
Laurie Hendren, McGill University, Canada
Paola Inverardi, UniversitĂ dell'Aquila, Italy
Lingxiao Jiang, Singapore Management University, Singapore
Darko Marinov, University of Illinois at Urbana-Champaign, USA
Aditya V. Nori, Microsoft Research India
Corina Pasareanu, Carnegie Mellon University/NASA Ames Research Center, USA
Lori Pollock, University of Delaware, USA
Manu Sridharan, IBM T.J. Watson Research Center, USA
Paolo Tonella, Fondazione Bruno Kessler, Trento, Italy
Michael Whalen, University of Minnesota, USA
Tao Xie, North Carolina State University, USA
Charles Zhang, Hong Kong Univ of Science and Technology, China
Xiangyu Zhang, Purdue University, USA